Address:
Chongqing,China
Main Products:
BGA Rework Station,Solder balls,AMTECH Flux,BGA Reballing Template by handiwork,Adjustable Reballing Station
ACHI® IR6000 BGA rework stations feature
1, IR6000 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework
2, IR6000 Innovative designs .An effective solution to general of infrared rework station vulnerable to the impact of air flow. Will lead an inaccurate of temperature control. Maximum temperature up to 400 *C. Can easily deal with lead-free soldering rework.
3, IR6000 can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.
4, IR6000 can be connected to a computer to be controlled more conveniently with a built-in PC RS232 serial port and proprietary Software attached to it. programmable
5, IR6000 can easily rework the variety of CPU's seat, all kinds of shielding enclosures, replacement of various components slot.Can easily deal with lead-free soldering rework
6, IR6000 sensitive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring.
7, IR6000 BGA rework station the technology of closed-loop temperature control ensures accurate temperature process and even heat distribution.
8, IR6000 Machine overall system integration Design, Rework station more integrated workbench area occupied by smaller, Didn't mixed and disorderly of cables.
9, IR6000 Linear guide type Bracket for BGA Reworks. can be locking , adjusted by rotating the handle, Can be very easily fixed PCB board, effectively prevent the deformation of PCB board.
The parameters of ACHI ® IR6000 BGA Rework Station
Basic Parameters |
|
Heating |
IR |
Dimension |
L475mm X W480mm X H420 mm |
Weight |
15kg |
Total weight |
About 17 kg, vary with the differen need of the users |
Electrical Parameters |
|
Power |
220V AC |
Upper Heating |
IR |
Size of Upper heating |
80mmX80 mm |
Consumption of upper heating |
500W |
Bottom Heating |
IR |
Size of Bottom heating |
180 mmX180 mm |
Consumption of Bottom heating |
800W |
General power |
1350W |
Temperature Control |
|
Control mode of Upper |
Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm |
Control mode of Bottom |
Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm |
Rework Function |
|
SMD |
Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework , welding |
Size of applicable chips |
≤70mmX70 mm |
Size of applicable PCB |
≤400mmX305 mm |